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Mounting Technology - Company Ranking(14 companies in total)

Last Updated： Aggregation Period:May 27, 2026〜Jun 23, 2026
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
AndTech AndTech
Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.
Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

10,000 yen-100,000 yen

 **Part 1: Summary of the Lecture** Power devices generate heat during operation, so the materials used in these devices need to have heat ... Part 1: Improvement of Heat Resistance and Heat Dissipation in Encapsulation Materials for Power Devices [10:15-11:30] Instructor: Aipac...
Design, structure, assembly technology of LED packages, and implementation technology onto substrates.
Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

10,000 yen-100,000 yen

 【Speaker】 Mr. Gen Murakami, President of Mototen Co., Ltd., Ph.D. in Engineering 【Venue】 Kawasaki City Educational and Cultural Center, Ro... 1. Introduction 2. LED Package Assembly Technology 2.1 Types and Manufacturing Methods of LED Elements 2.2 LED Element Assembly ...
Design, structure, assembly technology of LED packages, and implementation technology onto substrates.
Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

10,000 yen-100,000 yen

 **Course Objectives and Aims** Semiconductor packaging technology is an essential technology that enhances the functionality of electronic... **Program** 1. Introduction 2. LED Package Assembly Technology 3. LED Device Mounting Substrate Materials 3-1. How to Choose High Therma...
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  1. AndTech AndTech
    Featured Products
    Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.
    overview
    **Part 1: Summary of the Lecture** Power devices generate heat during operation, so the materials used in these devices need to have heat ...
    Application/Performance example
    Part 1: Improvement of Heat Resistance and Heat Dissipation in Encapsulation Materials for Power Devices [10:15-11:30] Instructor: Aipac...
    Design, structure, assembly technology of LED packages, and implementation technology onto substrates.Design, structure, assembly technology of LED packages, and implementation technology onto substrates.
    overview
    【Speaker】 Mr. Gen Murakami, President of Mototen Co., Ltd., Ph.D. in Engineering 【Venue】 Kawasaki City Educational and Cultural Center, Ro...
    Application/Performance example
    1. Introduction 2. LED Package Assembly Technology 2.1 Types and Manufacturing Methods of LED Elements 2.2 LED Element Assembly ...
    Design, structure, assembly technology of LED packages, and implementation technology onto substrates.Design, structure, assembly technology of LED packages, and implementation technology onto substrates.
    overview
    **Course Objectives and Aims** Semiconductor packaging technology is an essential technology that enhances the functionality of electronic...
    Application/Performance example
    **Program** 1. Introduction 2. LED Package Assembly Technology 3. LED Device Mounting Substrate Materials 3-1. How to Choose High Therma...
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